Low Resistivity polymeric adhesives

Document Type : Original Article

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Egyptian Armed Forces.

Abstract

Samples of low resisitivty polymeric adhesives of epoxy type were prepared. Curing took place at the ordinary temperature and hardening was complete within about 15 minutes. The volume resistivity was about 1.5 x 10-4 0 Cm when the sample contained 25% by weight silver. Such low resistivity and short curing time allow the use of mentioned adhesive for repairing the broken low power electrical conductors. The prepared adhesive may also find many applications in electronic packing and silk screening.

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