Thermal modeling of a high fill-factor micromachined bolometer for thermal imaging applications

Document Type : Original Article

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Egyptian Armed Forces.

Abstract

Abstract:
Infrared radiation bolometer which is made of thin film of a aSi:H is thermally modeled
using 3-d finite element analysis method (FEA) .This bolometer is realized in a
multilevel electro thermal structure having high fill factor. Using the multilevel
structure, thermal isolation can be indepentely optimized without sacrificing IR
absorption area. The design show that thermal time constant of 12.95 ms, responsivity
of 4.65X103V/W,and detcetivity of 7.97X108cm Hz1/2w-1 can be achieved in
50μmx50μm michromachined structure.

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